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June 21, 2007
Topics to be discussed for MAP&RTS2007 are ...
■Device for automobile, sensing device
■MEMS and eco-device
■System in a Package (SiP), chip scale package(CSP)
■Equipment and manufacturing processes of SiP, CSP and wafer level processing
■Printed circuit board (PCB), substrate and interposer
■Precision parts and module fabrication technology
■Die attach and interconnection
■Plating, molding and encapsulation
■Soldering, bumping and bonding
■Testing and characterization
■New environment-friendly materials
■Total manufacturing and process integration
Posted by MAP&RTS2005Q : June 21, 2007 08:06 AM