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May 09, 2007
Scope of the Workshop
The aim of the MAP workshop is to facilitate the creation of a value network by linking Kyushu’s over 600 IC affiliated companies with companies in Asia through open discussion and sharing of state-of-art ideas, techniques and perspectives on microelectronics assembling and packaging among leading industrial companies and academia. The workshop will consist of invited and contributed presentations, exhibition show, poster session (Wafer testing, Packaging process, Substrate, Simulation, Package on Package etc.), public and private business meetings. The official language is English.
In MAP2006, over 400 managers and engineers gathered to discuss MEMS,wafer level package, SiP(System in a Package), advanced materials. For this year, the main topics will be device for automobile, MEMS, sensing device, eco-device, as well as advanced matreials and wafer test.
The reverse trade show (RTS) will be held in collaboration with the workshop in 2007. In normal trade show, the supplier present to buyers. RTS will give the oppotunity for conducting discussion of semiconductor business in front of the buyers booth.
Posted by MAP&RTS2005Q : May 9, 2007 10:37 PM