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October 02, 2006
Poster Session Exhibitor List
We will show you Poster Session Exhibitor List. This is a temporary one, so we will update it.
For more details, see the PDF file.
"Design and Simulation" Zone
FLUENT ASIA PACIFIC CO.,LTD. JAPAN Simulation Tool
NAGASE ELECTRONIC EQUIPMENT SERVICE CO.,LTD. JAPAN LSI Design Tool, Simulation Tool, DFMIT Design for Manufacturing and Integrative Technology
Moldflow Japan K.K. JAPAN Moldflow Plastics Insight
TOPPAN PRINTING CO.,LTD. JAPAN LSI Design, Trial Production Service of LSI
"Wafer Process" Zone
TOSHIBA CORPORATION Semiconductor Company JAPAN IDM, Foundry, Packaging , Testing
Renesas Technology Corp. JAPAN IDM，Next Generation SiP (Si via forming)
Semiconductor Manufacturing International Corp. SMIC CHINA Foundry, Wafer Process
"Assembling and Test Process" Zone
Renesas Kyushu Semiconductor Corp. JAPAN Packaging and Testing House, EMS
STK TECHNOLOGY CO.,LTD. JAPAN Testing, Test House
FUKURYO SEMICON ENGINEERING CORPORATION JAPAN Analysis for LSI, Advanced Analysis Technology Supporting SiP
King Yuan Electronics Co., Ltd. KYEC TAIWAN Testing, Test House
ALLVIA U.S.A. Packaging House, Cooper Plating Techniques For Through Wafer Vias
"Equipment for Inspection" Zone
Kyushu Institute of Technology JAPAN Univ., Inspection Equipment for Semiconducter Devise
Marubun Corporation JAPAN Agent, Inspection Equipment
MORITANI & CO.,LTD JAPAN Agent, Equipment, Ion Migration Testing Systems
SELASTAR Corp. / Technosem JAPAN Agent, Long Life Contact Probe (Twist Probe, Re-Test Free)
Fronter Semiconductor Manufacturing U.S.A. Equipment, Metrology Tool for BEOL
"Equipment for Manufacturing" Zone
Produce Co.,Ltd. JAPAN Equipment, Manufacture of Electronic Roll Printers
INTERTEC CORP. JAPAN Agent, Equipment
SAWA CORPORATION JAPAN Equipment, Metal Mask Washing Machine
SHIBUYA KOGYO CO.,LTD. JAPAN Equipment for Ball Mounter and FC Bonder
"Advanced Materials" Zone
SENJU METAL INDUSTRY Co.,LTD. JAPAN Material, Pn Free Solder for Semiconductor PKG
PROCESS LAB. MICRON Co.,Ltd JAPAN Material, Metal Mask for Semiconductor Devise
MALCOM Co.,Ltd. JAPAN Equipment, Reflow Machine for Cell Production System, Reflow Simulator
ACHILLES CORPORATION JAPAN Agent, Material, Wafer Package System, Conductive materials, non-electrified plastics, color conductive mattresses, electrification-resistant painting
Hitachi Chemical JAPAN New Material for PKG Substrate
Hanyang University KOREA Univ., Spark Plasma Sintering of ZnS-SiO2 Sputtering
Oak-Mitsui Technologies U.S.A. Material, Material for Embedded Capacitor
Okmetic FIINLAND Material, Silicon Wafer Solution for MEMS
"Substrate and Manufacturing Service" Zone
IBITECH CO.,LTD. JAPAN PCB, Interposer, Design and Trial Production Service for Interposer
Wabo Electronics JAPAN PCB, Design and product of precision PCBs, OEM
HITACHI ULSI Systems Co.,Ltd. JAPAN PCB, Design, JISSO Solutions
KOA CORPORATION JAPAN Interposer, PCB, LTCC
Oki Printed Circuits Co.,Ltd JAPAN PWB for Inspection and Testing for Semiconductor Device
SANYO Co.,Ltd. JAPAN Agent, Precision FPC
Hirai JAPAN LTCC Substrate (Low Temperature Cofired Ceramic, Malutilayer Substrate, Various Material Ething parts, Surface Treetment
Imbera FINLAND PCB, Embedding Discrete Components inside PCB Structure
For more details, see the PDF file.
Posted by MAP&RTS2005Q : October 2, 2006 02:34 PM