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May 10, 2006
Topics to be discussed for MAP2006 are ...
For MAP2006, the main theme will be MEMS, Sensor, three-dimensional packaging simulation technology and design for manufacturability (DFM).
Other topics to be discussed are
◆Technologies of System in a package (SiP), chip scale package (CSP)
◆Technology for Equipments and manufacturing processes of SiP, CSP and wafer level processing
◆Technologies for Printed circuit board (PCB), substrate and interposer
◆Precision parts and module fabrication technology
◆Die attach and interconnection technology
◆Plating, molding and encapsulation technology
◆Soldering, bumping and bonding technology
◆Testing and characterization technology
◆New environment-friendly materials
◆Total manufacturing and process integration
Posted by MAP&RTS2005Q : May 10, 2006 11:32 AM