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May 10, 2006
Topics to be discussed for MAP2006 are ...
For MAP2006, the main theme will be MEMS, Sensor, three-dimensional packaging simulation technology and design for manufacturability (DFM).
Other topics to be discussed are
◆Technologies of System in a package (SiP), chip scale package (CSP)
◆Technology for Equipments and manufacturing processes of SiP, CSP and wafer level processing
◆Technologies for Printed circuit board (PCB), substrate and interposer
◆Precision parts and module fabrication technology
◆Die attach and interconnection technology
◆Plating, molding and encapsulation technology
◆Soldering, bumping and bonding technology
◆Testing and characterization technology
◆New environment-friendly materials
◆Total manufacturing and process integration
Posted by MAP&RTS2005Q : 11:32 AM
May 09, 2006
Contact us!!
If there are any questions, please do not hesitate to access MAP2006 office by e-mail;
Kyushu Economic Research Center (KERC)
Persons in Charge: E. Hirataand H.Okano
e-mail: MAP@kerc.or.jp
Address: 1-9-48, Daimyo, Chuo-ku, Fukuoka 810-0041, JAPAN
Phone: +81-92-721-4900
Fax: +81-92-722-6205
Posted by MAP&RTS2005Q : 10:11 PM
Previous MAP&RTS
Previous MAP & RTS Workshops
●The1st Conference Nov 26-28, 2001
Theme of Conference: "Management of Technology Mixing"
Key Speakers: Colley Hwang, President, Digitimes Publication Inc. (TAIWAN)
Hatsumi Hamada, General Manager Research & Strategic Planning Department, SONY Corporation Semiconducter Network Company (JAPAN)
Number of Participants: 250
●The 2nd Conference Nov 25-27, 2002
Theme of Conference: "How about China?"
"What is Kyushu’s technology Strength?"
Title of Invited Talks: Ih-Chin Chen, Vice President, SMIC (CHINA)
Yoshihisa Toyosaki, President, iSuppli Corporation (JAPAN)
Number of Participants: 250
●The 3rd Conference Nov 11-12, 2003 (The first RTS Exhibition)
Theme of Conference: "Technology Matching between Asian Application Company and Semiconductor Company in Kyushu"
Title of Invited Talks: Akio Takeuchi, President, SONY Semiconductor Kyushu (JAPAN)
Dong-Lim Kim, General Manager, Electronics Parts Team, Procurement Center, SAMSUNG Japan (JAPAN)
Junshi Yamaguchi, Senior Vice President, NEC Electronics (JAPAN)
Ramli Othman, Director, Electronics Industries Division, MIDA (MALAYSIA)
Zhenyu Shi, R&D Division, HAIER (CHINA)
Number of Participants: 210
●The 4th Conference Nov 17-19, 2004 (The second RTS Exhibition)
Theme of Conference: "Management of Semiconductor Technology (MOST)"
"Semiconductor Module Business "
Title of Invited Talks: Eisaku Ohtsuru, SGM, Procurement Division Manager, SONY Semiconductor Kyushu (JAPAN)
Hideyuki Nishida, Principal Eng., R&D Sdv. Tech. Team, SAMSUNG Electro Mechanics (KOREA)
Hisato Ishibashi, Manager, Administration Department, Thai NJR (THAILAND)
Kazuto Nakamura, General Manager, Device SI Division, NEC Electronics (JAPAN)
Nirio Kubo, General Manager, SOC Dept., Yokogawa Electric Corporation (JAPAN)
Susumu Kohyama, President, Toshiba Ceramics (JAPAN)
Number of Participants: 220
●The 5th Conference Sep 17-19, 2005 (The Third RTS Exhibition)
Theme of Conference: "The future and Demand for LSI for Automobile Industry"
"Technology Trend: Package on Package (PoP), Testing, Evaluation, Substrate"
Title of Invited Talks: Jeff Shie, Marketing Sales, Episil Technology (TAIWAN)
Joseph Dowd, Founder, Silicon Pipe (U.S.A.)
Jun Taniguchi, Manager, CSP Product, Amkor Technology Japan (JAPAN)
Michio Sato, Assist. Dept. Manager, Automotive FAE Technology Dept., Freescale Semiconductor Japan (JAPAN)
Morihiro Kada, Assistant Department General Manager, Advanced Technology Development Center, Sharp Corporation (JAPAN)
Shuichi Otsuka, President, Hiroshima Elpida Memory (JAPAN)
Yusuke Yamamoto, Staff Engineer, Products Plannig Group, Panasonic Factory Solutions (JAPAN)
Number of Participants: 445
Posted by MAP&RTS2005Q : 11:36 AM
Previous Participants
CHINA: Auto Instrument, Dalian Daxian, EASTCOM, HAIER, Hangzhou Hi-Tech Zone Modem Tele-industrial Park, HISENSE, Hong Kong Science and Technology Parks Corporation, Kengoo Group, KONGYUE Electronics & Information Industry, Toec Technology, SMIC, Tianjin Global Magnetic Card, Tianjin Zhonghuan Semiconductor, Yantai Kingwell Technology
KOREA: Amkor Technology Inc., Genitech, KAIST, Korea Materials & Analysis, KOREA MD COM, M.D. Excimer, MEMS ware, SAMSUNG, Samsung Electro-Mechanics, Shinwon Tech, TELEPHUS
TAIWAN: Digitimes, Episil Technology Inc., King Yuan Electronics Co., Ltd. (KYEC), MEGIC
MALAYSIA: AKTY Technologies, BIM Technologies, MIDA
THAI: Thai NJR
SINGAPORE: Institute of Microelectronics, Manufacturing Integration Technology Ltd.
U.S.A: CAD Design Software, Integrated Reliability test System Inc., Microtec Laboratories, Moldflow Corporation, President Control System, Silicon Pipe Inc.
JAPAN: Advantest Inc., AET Japan Inc., ALDETE Corporation, Amkor Technology Japan, Appllowave Corp., Aska Corporation Co., Ltd., ATE Service Corporation Atomnics Laboratory Inc., BOSE Psycho Physics Research Inc., Casio Computer Co., Ltd., Cybernet Systems Co., Ltd., D-Clue Technologies Inc., ELIA Co., Ltd., Elpida Memory Inc., EXCEL TECHNOLOGY JAPAN K.K., Exploitation of Next Generation Co., Ltd., Fluent Asia Pacific Co., Ltd., Freescale Semiconductor Japan Ltd., Fukuryo Semicon Engineering Co., Ltd., Gaio Technology Co., Ltd., Genesis Technology Inc. Hamamatsu Photonics K.K., Hano Seisakusho Co. Ltd., Hanwa Electronics Industry Co., Ltd., Harima Chemicals Inc., HARADA Corporation, Hara Seiki Industry Co., Ltd., Hayashi Co., Ltd., Hioki Electric Equipment Co., Ltd., Hiji Hitec Co., Ltd., Hirai Seimitsu Kogyo Corporation, Hitachi Chemical Co., Ltd., Hitachi ULSI Systems Co., Ltd., IBITECH Co., Ltd., iSupply Corporation, INOUEKI Co., Ltd., Interconnection Technologies Co., Ltd., Japan air Gases Co., Ltd., Japan Circuit Industrial Co., Ltd., Japan UNIX Co., Ltd., Jedat Innovation Inc., JEOL Ltd., JM Net Inc., Keirex Technology Inc., Kyoritsu Elex Co., Ltd., Kyushu Nissho Co., Ltd., Kyushu Mitsumi Co., Ltd., Matsushita Electronics Co., Ltd., MALCOM Co., Ltd., Marubun Co., Ltd., Minami Co., Ltd., Mitsubishi Electric Co., Ltd., Miyazaki Oki Electric Industry Co., Ltd., Meico Denshi Co., Ltd., Meltex Inc., Moldflow Japan K.K., Nagase Electronic Equipment ServiceCo., Ltd., NEC Electronics Co., Ltd., New Japan Radio Co., Ltd., Nihonmicron Ltd., Nikon Corporation Instruments Company, Nikon Instech Co., Ltd., Nippon Graphite Industries, Ltd., Okabe Mica Co., Ltd., Oki Printed Circuits Co., Ltd., Okuma Electronic Co., Ltd., Olympus Corporation, Panasonic Factory Solutions Co., Ltd., Possible Hearts Inc., Renesas Technology Co., Ltd., Renesas Kyushu Semiconductor Co., Ltd., Rix Co., Ltd., RS Components K.K., Saga Electronics Co., Ltd., Sakurai Seigi Co., Ltd., Senjyu Metal Industry Co., Ltd., Sharp Corporation, Shinano Kenshi Co., Ltd., Shinryo Electronic Industry Co., Ltd., Sony Semiconductor Kyushu Co., Ltd., STK Technology Co., Ltd., SUNTEC Corporation, Syswave Co., Ltd., Takeda Sangyo Co., Ltd., TAMURA Corporation, Tanaka Corporation, Tektronix, Inc., Teradyne Inc., Toshiba LSI Packaging Solution Co., Ltd., Toshiba Corporation Semiconductor Company, Toshiba Ceramics Co., Ltd., TOTO LTD., Toppan Technical Design Center Co., Ltd., Ueno SeikiCo., Ltd., Seiko C & E Co., Ltd., Ulvac Kyushu Co., Ltd., Wavecom Co., Ltd., Yaskawa Electric Co., Ltd., Yamada Denon Co., Ltd., Yokogawa Electric Co., Ltd., Yoshimi Electronics Co., Ltd., System Fabrication Technologies Inc.
Posted by MAP&RTS2005Q : 11:27 AM