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2006年07月03日
過去の参加企業・団体（英語）
CHINA: Auto Instrument, Dalian Daxian, EASTCOM, HAIER, Hangzhou Hi-Tech Zone Modem Tele-industrial Park, HISENSE, Hong Kong Science and Technology Parks Corporation, Kengoo Group, KONGYUE Electronics & Information Industry, Toec Technology, SMIC, Tianjin Global Magnetic Card, Tianjin Zhonghuan Semiconductor, Yantai Kingwell Technology
KOREA: Amkor Technology Inc., Genitech, KAIST, Korea Materials & Analysis, KOREA MD COM, M.D. Excimer, MEMS ware, SAMSUNG, Samsung Electro-Mechanics, Shinwon Tech, TELEPHUS
TAIWAN: Digitimes, Episil Technology Inc., King Yuan Electronics Co., Ltd. (KYEC), MEGIC
MALAYSIA: AKTY Technologies, BIM Technologies, MIDA
THAI: Thai NJR
SINGAPORE: Institute of Microelectronics, Manufacturing Integration Technology Ltd.
U.S.A: CAD Design Software, Integrated Reliability test System Inc., Microtec Laboratories, Moldflow Corporation, President Control System, Silicon Pipe Inc.
JAPAN: Advantest Inc., AET Japan Inc., ALDETE Corporation, Amkor Technology Japan, Appllowave Corp., Aska Corporation Co., Ltd., ATE Service Corporation Atomnics Laboratory Inc., BOSE Psycho Physics Research Inc., Casio Computer Co., Ltd., Cybernet Systems Co., Ltd., D-Clue Technologies Inc., ELIA Co., Ltd., Elpida Memory Inc., EXCEL TECHNOLOGY JAPAN K.K., Exploitation of Next Generation Co., Ltd., Fluent Asia Pacific Co., Ltd., Freescale Semiconductor Japan Ltd., Fukuryo Semicon Engineering Co., Ltd., Gaio Technology Co., Ltd., Genesis Technology Inc. Hamamatsu Photonics K.K., Hano Seisakusho Co. Ltd., Hanwa Electronics Industry Co., Ltd., Harima Chemicals Inc., HARADA Corporation, Hara Seiki Industry Co., Ltd., Hayashi Co., Ltd., Hioki Electric Equipment Co., Ltd., Hiji Hitec Co., Ltd., Hirai Seimitsu Kogyo Corporation, Hitachi Chemical Co., Ltd., Hitachi ULSI Systems Co., Ltd., IBITECH Co., Ltd., iSupply Corporation, INOUEKI Co., Ltd., Interconnection Technologies Co., Ltd., Japan air Gases Co., Ltd., Japan Circuit Industrial Co., Ltd., Japan UNIX Co., Ltd., Jedat Innovation Inc., JEOL Ltd., JM Net Inc., Keirex Technology Inc., Kyoritsu Elex Co., Ltd., Kyushu Nissho Co., Ltd., Kyushu Mitsumi Co., Ltd., Matsushita Electronics Co., Ltd., MALCOM Co., Ltd., Marubun Co., Ltd., Minami Co., Ltd., Mitsubishi Electric Co., Ltd., Miyazaki Oki Electric Industry Co., Ltd., Meico Denshi Co., Ltd., Meltex Inc., Moldflow Japan K.K., Nagase Electronic Equipment ServiceCo., Ltd., NEC Electronics Co., Ltd., New Japan Radio Co., Ltd., Nihonmicron Ltd., Nikon Corporation Instruments Company, Nikon Instech Co., Ltd., Nippon Graphite Industries, Ltd., Okabe Mica Co., Ltd., Oki Printed Circuits Co., Ltd., Okuma Electronic Co., Ltd., Olympus Corporation, Panasonic Factory Solutions Co., Ltd., Possible Hearts Inc., Renesas Technology Co., Ltd., Renesas Kyushu Semiconductor Co., Ltd., Rix Co., Ltd., RS Components K.K., Saga Electronics Co., Ltd., Sakurai Seigi Co., Ltd., Senjyu Metal Industry Co., Ltd., Sharp Corporation, Shinano Kenshi Co., Ltd., Shinryo Electronic Industry Co., Ltd., Sony Semiconductor Kyushu Co., Ltd., STK Technology Co., Ltd., SUNTEC Corporation, Syswave Co., Ltd., Takeda Sangyo Co., Ltd., TAMURA Corporation, Tanaka Corporation, Tektronix, Inc., Teradyne Inc., Toshiba LSI Packaging Solution Co., Ltd., Toshiba Corporation Semiconductor Company, Toshiba Ceramics Co., Ltd., TOTO LTD., Toppan Technical Design Center Co., Ltd., Ueno SeikiCo., Ltd., Seiko C & E Co., Ltd., Ulvac Kyushu Co., Ltd., Wavecom Co., Ltd., Yaskawa Electric Co., Ltd., Yamada Denon Co., Ltd., Yokogawa Electric Co., Ltd., Yoshimi Electronics Co., Ltd., System Fabrication Technologies Inc.
投稿者 MAP&RTS2005Q : 2006年07月03日 14:55